Electroplating solutions
NBT has designed specialised electroplating solutions based on many years of engineering experience and application expertise for MEMS, semiconductor industries, PCBs and photovoltaic technologies. The portfolio comprises plating solutions for nickel (Ni), gold (Au), silver (Ag), tin (Sn), Palladium (Pd), indium (In), nickel manganese (NiMn), or bismuth (Bi).
Grauer & Weil (India) Limited (Growel) promotes NB Semiplate Au 100 on Electronica India 2024
Product | Application | Features |
NB Semiplate Au 100 | surface finishing bond pads |
very stable bath, sulfite based very uniform thickness, shiny surface, arsenite grain refiner low temperature plating |
NB Semiplate Au 100 TL | surface finishing bond pads |
very stable bath, sulfite based very uniform thickness, shiny surface, grain refiner free of arsenite low temperature plating |
NB Semiplate Cu 100 | conducting lines sacrificial layer |
sulfuric acid based, shiny surface, uniform thickness, low stress |
NB Semiplate Cu 150 | conducting lines sacrificial layer |
designed for inert anode process sulfuric acid based, shiny surface, uniform thickness |
NB Semiplate Sn 100 | soldering surface finish |
MSA based, good bonding |
NB Semiplate Sn 150 | soldering surface finish |
designed for inert anode process, MSA based, good bonding |
NB Semiplate Ni 100 | mechanical elements, barrier layer |
high purity bath and deposit, medium temperature plating, low stress, controlled mechanical properties |
NB Semiplate NiMn 100 | mechanical elements (switches, relays, tethers) |
low-creep Ni, stable grain size under temperature and mechanical load |
NB Semiplate In 100 | soldering or bonding | alkaline, non-cyanide matte, fine-grained surface |
NB Semiplate Ag 100 | conductors, surface finish | alkaline, cyanide-free Ag, compatible with resist mask |
NB Semiplate Bi 100 | absorber layer in space applications |
pure bismuth plating solution |
NB Semiplate Pd 200 | surface finish barrier layer |
alkaline bath, 0,3 to 1μm thickness compatible with resist |
NB sunNiSi 100 | porous Si etching and Ni plating from one solution |
ethanol-free, low HF concentration plates Ni in nm-pores excellent adhesion |