Wafer face-up tool

In our wafer face-up electroplating system, the reaction chamber is inverted, enabling work with electrolytes without air traps. The electrolyte flow is determined by the gap dimension and the liquid column. The system can be used as bench top in standard fume hoods by research and development laboratories.

Basic scope

• 20 liter bath volumen

Application

• Through silicon via (TSV) plating
• Electroplating into deep structures
• Dual-damascene process

Advantages

• Wafer face up avoids air trapping
• Adjustable electrolyte flow by liquid column and gap size
• Substrate size 4", 6", 8"